42%NiFe 42alloys
42%Ni-Fe
Related standardsASTM F-30 equivalent (UNS K94100)
ApplicationsSemiconductor lead frames, piezoelectric diaphragms, sealing materials, etc.
Nickel-iron alloy for lead frames with superior stamping workability and etching workability.
This alloy possesses superior dimensional accuracy such as plate thickness accuracy and flatness.
The dimension is very stable with little shape variation even after forming on lead frames.
Due to its superior surface cleanliness, plated films have great adhesion to 42%Ni-Fe.
In addition, the oxide film generated during sealing is dense and has excellent adhesion to oxides such as glass.
42%Ni-Fe is very compatible with the package because its thermal expansion coefficient is low and close to that of silicon and ceramics.
Chemical composition
[wt%]
Ni | Fe | |
---|---|---|
Typical values | 41 | Rem. |
Physical properties
Melting point [℃] | 1425 |
---|---|
Curie point [℃] | 375 |
Density [g/cm3@20℃] | 8.2 |
Thermal expansion coefficient [10-6/K@30-300℃] |
4.2 |
Thermal conductivity [W/m・K@20℃] |
14.7 |
Volume resistivity [μΩ・m] | 0.55 |
Young’s modulus [kN/mm2] | 145 |
*Please note that the values in all the tables are reference values and are subject to change without notice.
Mechanical properties
Temper | Tensile strength(typical value) [N/mm2] |
Elongation(typical value) [%] |
Vickers hardness(typical value) [HV] |
---|---|---|---|
A (0.25mmt) |
515 | 35 | 135 |
1/2H (0.10mmt) |
700 | 9 | 210 |