Iwata Technology Center
At DOWA METALTECH, we are always working to develop technologies and products
that are ahead of the times by keeping a focus on customer needs and market trends related
to new materials and plating.
We focus our efforts on new developments and process technology innovation driven by our
customers’ perspectives. This yields improvements that enable us to deliver easier-to-use
materials, better quality and higher quality stability, as well as better materials and
surface treatments.
Research Accomplishments
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お知らせ
Technical Support Information
Awarded the 55th Paper Award from the Japan Institute of Copper for our paper entitled, Strengthening mechanism of Cu-Ni-Al Alloys for VCM Leaf Spring
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Technical Support Information
C7035 TR04, a highly conductive version of our C7035 was added, to our product lineup.
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Technical Support Information
Registered the trademark “SilC plating™” for our excellent wear resistancesilver-carbon plating.
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Technical Support Information
Awarded the 54th Paper Award from the Japan Institute of Copper for our paper entitled, Strengthening by Annealing at A Low Temperature on Cu-Ni-Co-Si Alloys for Micro Connectors
* Related Product: C7035 -
Technical Support Information
DSC-3N HC, a highly conductive version of our DSC-3N was added, to our product lineup.
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Technical Support Information
Awarded the 53rd Paper Award from the Japan Institute of Copper for our paper entitled, “Improvement of Stress Corrosion Cracking Susceptibility in Cu-Zn Alloys.”
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Technical Support Information
Awarded the 42nd Technology Development Award from the Japan Institute of Metals and Materials for our paper entitled, “Development of the High Wear Resistance Silver Composite Coating for EV/PHV Terminals”
* Related Product:SilC plating™ -
Technical Support Information
Awarded the 52nd Paper Award from the Japan Institute of Copper for our papers entitled, The Effect of Layer Structure on Sliding Characteristics of Tin Plated Copper Alloy”and “Development of Cu-Ni-Co-Si Alloys with High Electrical Conductivity by the Optimization of Thermomechanical Treatment”
* Related product: tin plating -
Technical Support Information
Awarded the 51st Paper Award from the Japan Institute of Copper for our paper entitled, “Development of Cu-Ni-Si Alloy for Thin Multi-pin Lead Frames.”
*Related Product: C7025 -
Technical Support Information
Awarded the 39th Technology Development Award from the Japan Institute of Metals and Materials for our paper entitled, “Development of Excellent Fatigue Characteristic Cu-Ti Alloys by Suppression of Grain-Boundary Reaction Precipitates”
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Technical Support Information
Awarded the 49th Paper Award from the Japan Institute of Copper for our paper entitled, Development of Excellent Fatigue Characteristic Cu-Ti Alloys by Suppression of Grain-Boundary Reaction Precipitates
Analysis Equipment and Analysis Cases
| Analysis Equipment | Features |
|---|---|
| FIB | High-precision cross-section processing of solids (bulk and powder) |
| FE-SEM+EBSD | Solid (bulk and powder) sample surface roughness, shape observation, crystal orientation analysis |
| FE-SEM+EDS | Solid (bulk and powder) sample surface roughness, shape observation, elemental analysis (qualitative and semi-quantitative) |
| TEM+EDS | Solid (bulk and powder) transmission electron imaging and elemental analysis (qualitative and semi-quantitative) |
| SEM+EPMA | Solid (bulk and powder) elemental analysis (qualitative and semi-quantitative) and existence state analysis |
| FE-AES | Solid (bulk and powder) sample surface and depth direction elemental analysis (qualitative and semi-quantitative) |
| XPS | Solid (bulk and powder) sample surface elemental analysis and chemical state analysis (depth 100 Å) |
| XRF | Liquid and solid (bulk and powder) elemental analysis (qualitative and semi-quantitative) |
| XRD | Solid (bulk and powder) compound identification and orientation measurement |
* Above analyses are examples. We have many other analysis devices. Please feel free to contact us regarding additional information.
Analysis Cases
Crystal orientation analysis
Combined SEM with electron backscatter diffraction (EBSD) to make it possible to perform
micro-crystal orientation analysis.
The lower right figure shows the reverse pole of C7035.
