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Tin STAR

Tin plating (Advanced Reflow / STAR)

ApplicationsSmall terminals in automobiles, terminals for connector applications, etc.

Advanced Reflow has superior heat resistance and solderability.
STAR achieves low insertion force.

Advanced Reflow contains barrier structure which achieves superior heat resistance over that of conventional tin plating.
In addition, it has excellent solderability and whisker resistance, making it suitable for lead-free soldering.
If you have an application that requires lower connector insertion force, we also offer STAR (Super Thin Advanced Reflow) that can achieve both superior heat resistance and low insertion force.
Our products can be procured locally from Wieland in the United States and DOWA ADVANCED MATERIALS (NANKONG) in China.

Plating specifications

Plating thickness [μm]
Underplating (barrier) Sn
Reflow tin 1.0-2.0
Advanced Reflow 0.2-1.2 1.0-2.0
STAR 0.2-1.2 0.5-1.0

 

Material thickness at which material can be processed [mm]
Material thickness Material width
Pre-plated material 0.15-1.2 225 Max.

*Please contact us regarding specifications other than above.

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+81-53-453-4221

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