Awarded the 55th Paper Award from the Japan Institute of Copper for our paper entitled, Strengthening mechanism of Cu-Ni-Al Alloys for VCM Leaf Spring

C7035 TR04, a highly conductive version of our C7035 was added, to our product lineup.

Registered the trademark “SilC plating™” for our excellent wear resistancesilver-carbon plating.

Awarded the 54th Paper Award from the Japan Institute of Copper for our paper entitled, Strengthening by Annealing at A Low Temperature on Cu-Ni-Co-Si Alloys for Micro Connectors
* Related Product: C7035

DSC-3N HC, a highly conductive version of our DSC-3N was added, to our product lineup.

Awarded the 53rd Paper Award from the Japan Institute of Copper for our paper entitled, “Improvement of Stress Corrosion Cracking Susceptibility in Cu-Zn Alloys.”

Awarded the 42nd Technology Development Award from the Japan Institute of Metals and Materials for our paper entitled, “Development of the High Wear Resistance Silver Composite Coating for EV/PHV Terminals”
* Related Product:SilC plating™

Awarded the 52nd Paper Award from the Japan Institute of Copper for our papers entitled, The Effect of Layer Structure on Sliding Characteristics of Tin Plated Copper Alloy”and “Development of Cu-Ni-Co-Si Alloys with High Electrical Conductivity by the Optimization of Thermomechanical Treatment”
* Related product: tin plating

Awarded the 51st Paper Award from the Japan Institute of Copper for our paper entitled, “Development of Cu-Ni-Si Alloy for Thin Multi-pin Lead Frames.”
*Related Product: C7025

Awarded the 39th Technology Development Award from the Japan Institute of Metals and Materials for our paper entitled, “Development of Excellent Fatigue Characteristic Cu-Ti Alloys by Suppression of Grain-Boundary Reaction Precipitates”

Awarded the 49th Paper Award from the Japan Institute of Copper for our paper entitled, Development of Excellent Fatigue Characteristic Cu-Ti Alloys by Suppression of Grain-Boundary Reaction Precipitates