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YCuTFX

YCuT-FX

Related standardsCDA C19900

ApplicationsConnectors, relays, switches, jacks, etc.

Titanium-copper alloy that has possesses strength exceeding 1000N/mm2 and superior bending workability.

A titanium-copper alloy which possesses top-class high strength and superior bending workability.
It is widely used in connectors that undergo complicated bending in such electronic devices as smartphones.
It has superior stress relaxation resistance in the temperatures as high as 200 °C.
As such, its application in connectors and switches for automobiles is increasing.
We have had many clients succeed in using this material as a substitute for high-strength beryllium copper.

Chemical composition

[wt%]

Ti Cu
Typical values 3.2 Rem.

Physical properties

Melting point [℃] 1075
Density [g/cm3@20℃] 8.7
Thermal expansion coefficient
[10-6/K@20-300℃]
17.6
Electrical conductivity
[%IACS@20℃]
13
Volume resistivity [μΩ・m] 0.14
Thermal conductivity
[W/m・K@20℃]
50
Young’s modulus [kN/mm2] 125
Poisson’s ratio 0.33
Magnetic properties Non-magnetism

Mechanical properties

Temper Tensile strength
(typical value)
[N/mm2]
0.2% yield strength
[N/mm2]
Elongation
(typical value)
[%]
Vickers hardness
(typical value)
[HV]
H 985 850-1000
(830 Min.)*1
15 310
EH 1025 900-1050
(880 Min.)*2
10 320
SH 1075 950-1150 5 330
ESH 1115 1000-1200 3 340

*1:Product specifications with a plate thickness of more than 0.25 mm
*2:Product specifications with a plate thickness of more than 0.22 mm

Bending workability (W bend, bending width=10mm)

Temper Thickness range
[mm]
MBR/t
Good Way Bad Way
H t ≦ 0.15 0.0 0.5
0.15 < t < 0.25 0.5 1.0
EH t ≦ 0.12 0.0 1.0
0.12 < t ≦0.22 1.0 2.0
SH t ≦ 0.08 0.0 1.0
0.08 < t ≦0.10 1.0 2.0
0.10 < t < 0.15 1.0 3.0
ESH t < 0.08 0.5 4.0
0.08 ≦ t ≦0.10 1.0 6.0

*Please note that the values in the table are reference values and are subject to change without notice.

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