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C7025

Related standardsCDA C70250、 ASTM B422、JASO JC400(TM00、TM02、TM03)

ApplicationsSemiconductor lead frames, connectors, etc.

Corson copper alloy for lead frame connectors with superior strength and conductivity.

The 1/2H and SH tempers have superior stamping workability and etching workability, making them ideal for lead frame applications that require high dimensional accuracy.
Since it possesses the same non-magnetism as pure copper, it is the best non-magnetic lead frame material for sensors, etc.
The SH temper has higher strength than conventional lead frame materials, and it helps make lead frame thinner and reduce deformation defects during QFN package manufacturing.
The TM temper has superior stress relaxation resistance and is widely used as connector material for automobiles that requires high reliability.

Chemical composition

[wt%]

Ni Si Mg Cu
Typical values 3.0 0.65 0.15 Rem.

Physical properties

Melting point [℃] 1095
Density [g/cm3@20℃] 8.8
Thermal expansion coefficient
[10-6/K@20-300℃]
17.3
Volume resistivity [μΩ・m] 3.3x10-2
(1/2H)
Thermal conductivity
[W/m・K@20℃]
214
(1/2H)
Young’s modulus [kN/mm2] 132
(1/2H)
Poisson’s ratio 0.33
Magnetic properties Non-magnetism

Mechanical characteristics and conductivity of C7025 (TR series) for lead frames

Temper Tensile strength
[N/mm2]
Elongation
[%]
Vickers hardness
[HV]
Electrical conductivity
(typical value)
[%IACS]
1/2H 607-726 6 Min. 180-220 52
SH 800-950 1 Min. 235-300 47

Mechanical characteristics and conductivity of C7025 (TM series) for connectors

Temper Tensile strength
[N/mm2]
0.2 % yield strength
[N/mm2]
Elongation
(typical value)
[%]
Vickers hardness
[HV]
Electrical conductivity
(typical value)
[%IACS]
TM00 620-760 450-620 16 180 Min. 45
TM02 655-830 590-760 13 190 Min. 45
TM03 690-860 655-830 11 200 Min. 45

Bending workability (W bend, bending width=10mm)

Temper MBR/t
Good Way Bad Way
TM00 1.5 1.25
TM02 2.5 1.5
TM03 2.5 2.0

*Please note that the values in the table are reference values and are subject to change without notice.

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