Product searchYCuTM
YCuT-M
Related standardsCDA C19900, JIS C1990 equivalent (1/4H, EH)
ApplicationsConnectors, relays, switches, jacks, etc.
Titanium-copper alloy with top-class strength and stress relaxation resistance among copper alloys.
A titanium-copper alloy with high strength and superior stress relaxation resistance comparable to beryllium copper.
It is used in connectors for electronic devices such as smartphones and relays and switches for industrial machines.
We have had many clients succeed in using this material as a substitute for high-strength beryllium copper.
Chemical composition
[wt%]
| Ti | Cu | |
|---|---|---|
| Typical values | 3.2 | Rem. |
Physical properties
| Melting point [℃] | 1075 |
|---|---|
| Density [g/cm3@20℃] | 8.7 |
| Thermal expansion coefficient [10-6/K@20-300℃] |
17.6 |
| Thermal conductivity [W/m・K@20℃] |
50 (EH) |
| Electrical conductivity [%IACS@20℃] |
12 (EH) |
| Young’s modulus [kN/mm2] | 117 (EH) |
| Poisson’s ratio | 0.33 |
| Magnetic properties | Non-magnetism |
Mechanical properties
| Temper | Tensile strength [N/mm2] |
0.2% yield strength (typical value) [N/mm2] |
Elongation (typical value) [%] |
Vickers hardness (typical value) [HV] |
|---|---|---|---|---|
| 1/4H | 735-930 | 700 | 23 | 275 |
| 1/2H | 785-980 | 760 | 18 | 300 |
| H | 835-1030 | 810 | 13 | 310 |
| EH | 885-1080 | 900 | 11 | 330 |
| SH | 930-1130 | 990 | 4 | 340 |
Bending workability (W bend, bending width=10mm)
| Temper | MBR/t | |
|---|---|---|
| Good Way | Bad Way | |
| 1/4H | 1.0 | 1.5 |
| 1/2H | 1.5 | 2.0 |
| H | 1.5 | 3.0 |
| EH | 2.0 | 6.0 |
| SH | 3.0 | – |
*Please note that the values in the table are reference values and are subject to change without notice.
